Work

A thermode bonding process for fine pitch flip chip applications down to 40 micron

Year: 2002

Type: conference-paper

Source: IEEE/CPMT International Electronics Manufacturing Technology Symposium

DOI: 10.1109/emap.2001.983977

Authors: B. Pahl, S. Nieland, C. Kallmayer, R. Aschenbrenner, H. Reichl

Institutions: Technische Universität Berlin, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2135247463

FWCI: 1.126

Cites: 7

Cited by: 5

Related to: 10