Author

Nishant Malik

Observed name: N. Malik

Institution: Integrated Detector Electronics AS (Norway)

Observed institutions: SINTEF, University of Oslo, Integrated Detector Electronics AS (Norway)

OpenAlex ID: A5048849357

AlAl thermocompression bonding for wafer-level MEMS sealing

2014 · N. Malik, K. Schjølberg-Henriksen, et al. · Sensors and Actuators A Physical · 61

Impact of SiO 2 on Al–Al thermocompression wafer bonding

2015 · Nishant Malik, Kari Schjølberg-Henriksen, et al. · Journal of Micromechanics and Microengineering · 26

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Low-Temperature Aluminum-Aluminum Wafer Bonding

2016 · Bernhard Rebhan, Andreas Hinterreiter, et al. · ECS Transactions · 17

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Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding

2017 · Mark S. Goorsky, Kari Schjølberg-Henriksen, et al. · Japanese Journal of Applied Physics · 12

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Wafer Level Capping Technology for Vacuum Packaging of Microbolometers

2023 · Kai Zoschke, Charles Alix Manier, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7

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Texture of Al films for wafer-level thermocompression bonding

2017 · Nishant Malik, Vishnukanthan Venkatachalapathy, et al. · Superlattices and Microstructures · 4

Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity

2015 · N. Malik, E. Poppe, et al. · ECS Journal of Solid State Science and Technology · 4

Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding

2014 · Kari Schjølberg-Henriksen, Nishant Malik, et al. · ECS Transactions · 4

The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au

2018 · Pranav Ambhore, Karthick Mani, et al. · ECS Transactions · 3

Al-Al wafer-level thermocompression bonding applied for MEMS

2017 · M.M. Visser Taklo, K. Schjolberg-Henriksen, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 3

Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

2015 · K. Schjølberg-Henriksen, N. Malik, et al. · ECS Journal of Solid State Science and Technology · 3

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Low-temperature bonding technologies for MEMS and 3D-IC

2014 · M.M.V. Taklo, K. Schjolberg-Henriksen, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 3

The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au

2018 · Pranav Ambhore, Karthick Mani, et al. · ECS Meeting Abstracts

Low-Temperature Aluminum-Aluminum Wafer Bonding

2016 · Bernhard Rebhan, Andreas Hinterreiter, et al. · ECS Meeting Abstracts

Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

2014 · Kari Schjølberg-Henriksen, Nishant Malik, et al. · ECS Transactions

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Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

2014 · Kari Schjølberg-Henriksen, Nishant Malik, et al. · ECS Meeting Abstracts

Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding

2014 · Kari Schjølberg-Henriksen, Nishant Malik, et al. · ECS Meeting Abstracts

Works count: 17

Citation count: 147

H-index: 5

I10-index: 4