Work

Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

Year: 2014

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2014-02/34/1740

Authors: Kari Schjølberg-Henriksen, Nishant Malik, Elin Vold Gundersen, Oscar Rincon Christiansen, Kristin Imenes, Sigurd Teodor Moe

Institutions: SINTEF, University of Oslo, Buskerud and Vestfold University College

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4232199523

Cites:

Cited by:

Related to: 10