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David Cruau

Leaching mechanisms in immersion lithography with or without top coat
2007 · S. Gaugiran, R. Feilleux, et al. · Microelectronic Engineering · 14
Ultra Thin Chips Stacking on Tsv Silicon Interposer Using Back-to-face Technology
2012 · G. Parès, F. Schnegg, et al. · IMAPSource Proceedings · 5
Engineering nano interfacial layers for low contact resistance in chip to package interconnects
2009 · Jianwen Steven Xu, Lakshmi Ramanathan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Investigation on immersion defectivity root cause
2007 · V. Farys, S. Gaugiran, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Integrating immersion lithography in 45-nm logic manufacturing
2007 · Michael Benndorf, Scott Warrick, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Immersion lithography robustness for the C065 node
2006 · Scott Warrick, Rob Morton, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Works count: 6
Citation count: 23
H-index: 3
I10-index: 1
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