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Thomas Loeher
Observed names:
Loeher, T.,
T. Loeher
Institution:
Fraunhofer Institute for Reliability and Microintegration
Observed institutions:
Fraunhofer Institute for Reliability and Microintegration,
Technische Universität Berlin
OpenAlex ID:
A5056385151
Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
2005
·
M. L. Huang
, T. Loeher
, et al.
·
Applied Physics Letters
·
93
Reliability issues in Pb-free solder joint miniaturization
2006
·
Zhiheng Huang
, Paul P. Conway
, et al.
·
Journal of Electronic Materials
·
44
Embedding and assembly of ultrathin chips in multilayer flex boards
2008
·
W. Christiaens
, T. Loeher
, et al.
·
Circuit World
·
33
SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes
2012
·
Jan Vanfleteren
, Thomas Loeher
, et al.
·
Circuit World
·
29
Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
2006
·
M. L. Huang
, T. Loeher
, et al.
·
Journal of Electronic Materials
·
26
Strategies for Embedding of Active Components
2006
·
A. Ostmann
, D. Manessis
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
10
Ultrathin soldered flip chip interconnections on flexible substrates
2004
·
B. Pahl
, T. Loeher
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Stretchable conductor technology for elastic electronic systems
2007
·
Johan De Baets
, Fabrice Axisa
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
3
Embedded ultra-thin chips in flex
2005
·
Wim Christiaens
, Michael Feil
, et al.
·
Ghent University Academic Bibliography (Ghent University)
·
3
Large area processes for 3D shaped electronics
2016
·
Andreas Ostmann
, Thomas Loeher
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
Failure Analysis of Sub-50 μm Lead-free Solder Bumps on Electroless Ni-P UBM for Flip Chip Interconnects
2006
·
D. Manessis
, Mingliang Huang
, et al.
·
Electronic Packaging Technology Conference
·
1
Modular System Packaging By Embedding: Technologies, Applications and Perspectives
2011
·
Lars Boettcher
, Dionysios Manessis
, et al.
·
SMTA International
Embedding of active components in multilayer flex boards
2007
·
Wim Christiaens
, T. Loeher
, et al.
·
Ghent University Academic Bibliography (Ghent University)
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Works count:
18
Citation count:
248
H-index:
6
I10-index:
6
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