Work

Large area processes for 3D shaped electronics

Year: 2016

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc.2016.7764463

Authors: Andreas Ostmann, Thomas Loeher, Manuel Seckel, Klaus-Dieter Lang

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: European Commission

OpenAlex ID: W2561995233

FWCI:

Cites: 10

Cited by: 1

Related to: 10