Get started
Author

Hyuekjae Lee

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics
2022 · Min-Ki Kim, Soojeoung Park, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 35
A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking
2024 · Hyeonmin Lee, Jihoon Kim, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
Works count: 2
Citation count: 56
H-index: 2
I10-index: 2
Year
Topic
Type