Work

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Year: 2022

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51906.2022.00062

Authors: Min-Ki Kim, Soojeoung Park, Aeni Jang, Hyuekjae Lee, Seungduk Baek, ChungSun Lee, Ilhwan Kim, Jumyong Park, Youngkun Jee, Un-Byoung Kang, Dae-Woo Kim

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4285103191

FWCI: 12.16

Cites: 8

Cited by: 35

Related to: 10