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Alex Juan

Observed name: A. Juan
Observed institution: United Microelectronics (Taiwan)
OpenAlex ID: A5068699809
Degradation and failure analysis of Polysilicon Resistor connecting with Tungsten contact and Copper line
2011 · Clement Huang, Mingte Lin, et al. · IEEE International Reliability Physics Symposium proceedings · 7
Polarity Dependence of the Conduction Mechanism in Interlevel Low-$k$ Dielectrics
2012 · Mingte Lin, James Liang, et al. · IEEE Electron Device Letters · 5
Polarity Dependence on Electrical Properties of Low-k Dielectric in Copper Interconnect Structures
2015 · M. Lin, J. Liang, et al. · International Conference on Solid State Devices and Materials (SSDM) · 3
Diffusion ability of Stress Induced Voiding in advanced BEOL copper process
2012 · Clement Huang, James W. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
Upstream electromigration study on multiple via structures in copper interconnect
2009 · Mingte Lin, Nick Jou, et al. · IEEE International Interconnect Technology Conference (IITC) · 3
The observation of mobile ion of 40nm node by Triangular Voltage Sweep
2014 · Clement Huang, James W. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects
2020 · Clement Huang, Alex Juan, et al. · IEEE International Reliability Physics Symposium proceedings · 1
Evaluation of inter and intra level TDDB of Cu/Low-k interconnect for high voltage application
2016 · Mingte Lin, Chihching Yang, et al. · IEEE International Reliability Physics Symposium proceedings · 1
Electrical properties of low-k dielectric in copper interconnect structures
2013 · Mingte Lin, J. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Polarity dependence of the conduction mechanism in inter-level low-k dielectrics
2012 · Mingte Lin, James W. Liang, et al. · IEEE International Reliability Physics Symposium proceedings · 1
Effect of multiple via structure on upstream electromigration in copper interconnect
2009 · Mingte Lin, Nick Jou, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Using Sub-microsecond Measurement to Monitor AC NBTI and Dividing Trap Types into NIT, NHT and NFT through Adjustable Stress Frequency and Measure Frequency
2015 · C. H. Chiang, N. Ke, et al. · International Conference on Solid State Devices and Materials (SSDM)
Electrical conduction effect on reliability of low-k dielectric in Cu interconnect
2013 · Mingte Lin, Alex Juan, et al.
Product dielectric reliability
2011 · J. K. Jerry Lee, S. Y. Pai, et al. · IEEE International Integrated Reliability Workshop final report
General estimation of Stress Induced Voiding for vias connected to large Cu plate
2011 · Clement Huang, James W. Liang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Works count: 15
Citation count: 28
H-index: 3
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