Work

Electrical properties of low-k dielectric in copper interconnect structures

Year: 2013

Type: conference-paper

Source: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DOI: 10.1109/ipfa.2013.6599154

Authors: Mingte Lin, J. Liang, A. Juan, K. C. Su

Institution: United Microelectronics (Taiwan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2071927719

FWCI:

Cites: 8

Cited by: 1

Related to: 10