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Alex H. Buxbaum
Observed names:
A Buxbaum,
A. Buxbaum,
Alex Buxbaum
Observed institutions:
Technion – Israel Institute of Technology,
Applied Materials (United States),
Thermo Fisher Scientific (Japan),
Carl Zeiss (United States),
Thermo Fisher Scientific (United States)
OpenAlex ID:
A5080146758
Compound formation at the interaction of Pd with strained layers of Si1−xGex epitaxially grown on Si(100)
1991
·
A. Buxbaum
, M. Eizenberg
, et al.
·
Applied Physics Letters
·
44
Three-dimensional chemical imaging of embedded nanoparticles using atom probe tomography
2012
·
Satyanarayana V N T Kuchibhatla
, V Shutthanandan
, et al.
·
Nanotechnology
·
24
PDF
Epitaxial growth of single-crystal Si1−xGex on Si(100) by ion beam sputter deposition
1990
·
F. Meyer
, C. Schwebel
, et al.
·
Thin Solid Films
·
23
Strain relaxation in epitaxial Si1−xGex/Si(100) layers induced by reaction with palladium
1992
·
A. Buxbaum
, E. Zolotoyabko
, et al.
·
Thin Solid Films
·
16
Interaction of Pd with Strained Layers of Si1-xGex Epitaxially Grown on Si(100)
1991
·
A. Buxbaum
, M. Eizenberg
, et al.
·
Japanese Journal of Applied Physics
·
16
PDF
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding
2010
·
W. H. Teh
, C. Deeb
, et al.
·
IEEE International D Systems Integration Conference
·
11
3D analysis of high-aspect ratio features in 3D-NAND
2020
·
Jens-Timo Neumann
, Dmitry Klochkov
, et al.
·
Metrology, Inspection, and Process Control XXXVI
·
9
Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology
2010
·
W.H. Teh
, C. Deeb
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
8
3D metrology solution for the 65-nm node
2004
·
Rick Kneedler
, Sergey Borodyansky
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
7
Endpoint solution for photomask chrome loads down to 0.25%
2002
·
Melisa J. Buie
, Brigitte C. Stoehr
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
7
Stress in Si1−xGex films prepared by ion sputtering: origin and relaxation
1992
·
Y. Le Meur
, F. Meyer
, et al.
·
Thin Solid Films
·
6
Applications of In-situ Sample Preparation and Modeling of SEM-STEM Imaging
2008
·
R.J. Young
, A. Buxbaum
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
4
Backside TEM Sample Preparation With The Multi-Loader Flip-Stage
2009
·
A Buxbaum
, R Schampers
, et al.
·
Microscopy and Microanalysis
·
3
PDF
Phase standard based on profilometer metrology standard
2004
·
Gregory P. Hughes
, Cindy Goodman
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
3
Compound Formation in Pd Metallized Strained Layers of Sige on Si
1991
·
A. Buxbaum
, M. Eizenberg
, et al.
·
MRS Proceedings
·
3
Sample Preparation and Analysis on Full-Thickness Silicon Wafers for Wafer-to-Wafer Bonding Process Development
2010
·
Richard J. Young
, Alex Buxbaum
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
2
Through-pitch characterization and printability for 65nm half-pitch alternating aperture phase shift applications
2005
·
Vicky Philipsen
, Leonardus Leunissen
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
2
DUV ALTA system aerial image enhancement for improved pattern fidelity
2003
·
Paul C. Allen
, Alex H. Buxbaum
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
2
Photoresist processing for high-resolution DUV lithography at 257 nm
2001
·
Scott E. Fuller
, Warren Montgomery
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
2
Low-kV FIB Applications and Workflows for Advanced Circuit Edit
2023
·
Rongjin Yan
, Majid Vaghayenegar
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
1
Application of 3D EBSD to a Two-Phase, Ultra-Fine Grain Titanium Alloy
2011
·
A Buxbaum
, S Sitzman
, et al.
·
Microscopy and Microanalysis
·
1
PDF
Recent Developments in TEM Applications for the IC Industry
2008
·
L. F. Fu
, Y. C. Wang
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
1
In-Situ Sample Preparation and Modeling of SEM-STEM Imaging
2008
·
RJ Young
, A Buxbaum
, et al.
·
Microscopy and Microanalysis
·
1
Integration and optimization of the DUV ALTA pattern generation system using a CAR process with the Tetra photomask etch system
2003
·
Alex H. Buxbaum
, Scott E. Fuller
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
Performance of the ALTA 3500 scanned-laser mask lithography system
1998
·
Peter D. Buck
, Alex H. Buxbaum
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
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Works count:
34
Citation count:
198
H-index:
8
I10-index:
6
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