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Nobutoshi Saito
Observed name:
N. Saito
Institution:
Ebara (Japan)
Observed institution:
Ebara (Japan)
OpenAlex ID:
A5080628899
Electroplating copper filling for 3D packaging
2009
·
Mizuki Nagai
, Yusuke Tamari
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
12
Process development of electroplate bumping for ULSI flip chip technology
2003
·
R. Kiumi
, J. Yoshioka
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Composition control for lead-free alloy electroplating on flip chip bumping
2005
·
R. Kiumi
, S. Takeda
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Processing, properties, and reliability of electroplated lead-free solder bumps
2003
·
R. Kiumi
, J. Yoshioka
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
6
21405 Electroplating for Cu through electrodes in 3D packaging
2008
·
Mizuki Nagai
, Akira Fukunaga
, et al.
·
The Proceedings of Conference of Kanto Branch
·
2
PDF
20303 Cu Electroplating Technology for Through-Silicon Electrode Formation in 3-Dimensional Packaging
2010
·
Masashi Shimoyama
, Mizuki Nagai
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
Formation of Lead-Free Microbumps by Electroplating for Flip-Chip and WLP Applications
2006
·
R. Kiumi
, F. Kuriyama
, et al.
·
Wafer-Level Packaging Symposium
Electroplating of Lead-Free Bumps on 300mm Wafers for WLP Applications
2005
·
N. Saito
, R. Kiumi
, et al.
·
Wafer-Level Packaging Symposium
Electroplating Of Cu Through Electrodes in 3D Packaging
2005
·
N. Saito
, R. Kiumi
, et al.
·
Wafer-Level Packaging Symposium
Void-Free Bumping Process for Lead-Free Solder
2004
·
J. Yoshioka
, R. Kiumi
, et al.
·
Wafer-Level Packaging Symposium
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Works count:
10
Citation count:
34
H-index:
4
I10-index:
1
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