Electroplating copper filling for 3D packaging
Year: 2009
Type: conference-paper
Authors: Mizuki Nagai, Yusuke Tamari, Nobutoshi Saito, Fumio Kuriyama, Akira Fukunaga, Akira Owatari, Shimoyama Masashi, Catherine Moore
Institution: Ebara (Japan)
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2133832016