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F. Kuriyama
Observed names:
Fumio KURIYAMA,
Fumio Kuriyama,
栗山, 文夫
Observed institutions:
National Institute of Standards and Technology,
Ebara (Japan)
OpenAlex ID:
A5086749447
Measurement of Heat Conduction through Stacked Screens
1998
·
M. A. Lewis
, T. Kuriyama
, et al.
·
Springer eBooks
·
31
Measurement of Heat Conduction through Stacked Screens
1997
·
T. Kuriyama
, F. Kuriyama
, et al.
·
Springer eBooks
·
13
Electroplating copper filling for 3D packaging
2009
·
Mizuki Nagai
, Yusuke Tamari
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
12
Analysis of mass and energy flow rates in an orifice pulse-tube refrigerator
1999
·
F. Kuriyama
, R. Radebaugh
·
Cryogenics
·
11
Process development of electroplate bumping for ULSI flip chip technology
2003
·
R. Kiumi
, J. Yoshioka
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Composition control for lead-free alloy electroplating on flip chip bumping
2005
·
R. Kiumi
, S. Takeda
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Processing, properties, and reliability of electroplated lead-free solder bumps
2003
·
R. Kiumi
, J. Yoshioka
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
6
Experimental research on the freezing process with super-cooling
2007
·
Akio saito
, Fumio Kuriyama
, et al.
·
Tokyo Tech Research Repository (Tokyo Institute of Technology)
·
3
21405 Electroplating for Cu through electrodes in 3D packaging
2008
·
Mizuki Nagai
, Akira Fukunaga
, et al.
·
The Proceedings of Conference of Kanto Branch
·
2
PDF
Heat Conduction with Supercooled Solidification
1982
·
Akio SAITO
, Ryusuke SHIMOMURA
, et al.
·
Bulletin of JSME
·
1
PDF
Analysis of Enthalpy Flows of Pulse Tube Refrigerators
2011
·
F. Kuriyama
·
Transactions of the Japan Society of Refrigerating and Air Conditioning Engineers
20303 Cu Electroplating Technology for Through-Silicon Electrode Formation in 3-Dimensional Packaging
2010
·
Masashi Shimoyama
, Mizuki Nagai
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
Formation of Lead-Free Microbumps by Electroplating for Flip-Chip and WLP Applications
2006
·
R. Kiumi
, F. Kuriyama
, et al.
·
Wafer-Level Packaging Symposium
Electroplating of Lead-Free Bumps on 300mm Wafers for WLP Applications
2005
·
N. Saito
, R. Kiumi
, et al.
·
Wafer-Level Packaging Symposium
Electroplating Of Cu Through Electrodes in 3D Packaging
2005
·
N. Saito
, R. Kiumi
, et al.
·
Wafer-Level Packaging Symposium
Void-Free Bumping Process for Lead-Free Solder
2004
·
J. Yoshioka
, R. Kiumi
, et al.
·
Wafer-Level Packaging Symposium
Increase in Reservoir Pressure of Orifice Ppulse Tube Refrigerators
1997
·
Fumio Kuriyama
, Yoshiro Fukasaku
·
Elsevier eBooks
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Works count:
18
Citation count:
93
H-index:
6
I10-index:
4
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