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Daquan Xia
Observed names:
Da Quan Xia,
Da-Quan Xia,
Da-quan Xia
Observed institution:
Chongqing University of Technology
OpenAlex ID:
A5081692579
Fatigue cracking growth of SAC305 solder ball under rapid thermal shock
2021
·
Cong Liu
, Daquan Xia
, et al.
·
Engineering Fracture Mechanics
·
19
Influence of thermal shock cycles on Sn-37Pb solder bumps
2019
·
Guisheng Gan
, Da-quan Xia
, et al.
·
Soldering and Surface Mount Technology
·
11
Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature
2018
·
Gui-Sheng Gan
, Lin-Qiao Gan
, et al.
·
MATERIALS TRANSACTIONS
·
10
PDF
Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics
2024
·
Wang Guo
, Xingang Chen
, et al.
·
Electronics
·
6
Property of Sn-37Pb solder bumps with different diameter during thermal shock
2021
·
Guisheng Gan
, Donghua Yang
, et al.
·
Soldering and Surface Mount Technology
·
5
Rapid preparation and its performance of Cu/Cu high-temperature solder joints
2025
·
Jun-feng Dou
, Gui-sheng Gan
, et al.
·
Materials Today Communications
·
2
Influence of Zn content on properties of Cu/SAC0307+xZn/Al joint by ultrasonic-assisted at low-temperature
2023
·
Jie Luo
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
2
Effect of Rapid Thermal Fatigue on Microstructure and Properties of Sn3.0Ag0.5Cu/Cu Solder Bumps
2020
·
Mizhe Tian
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
2
Cu/SiC heterogeneous interconnection with high-frequency ultrasound at low-temperature
2023
·
Hao Yang
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
1
Effect of Soldering Temperature on the Performance of Cu/Zn Foil + Cu Powder/Cu High-Temperature Joints
2025
·
Junfeng Dou
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Effect of double-side cooling packaging on the properties of dual-base-island packaging
2025
·
Qufeng Li
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Effect of nano-SAC0307 content on performance of Cu/Al joints in dual-ultrasonic assisted low-temperature soldering
2025
·
Junxiong Zhu
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Influence of Alloying Elements on Bonding Interface of Palladium-Plated Copper Wire in Humid and High Temperature Environment
2024
·
Xiaodong Wen
, Donghua Yang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Effect of Zn Content on the Performance of Cu/SAC0307+xZn/Al Joints with Dual Ultrasound Assistance
2023
·
Yongchong Ma
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Impact of Zn Content on Cu/Al Joints with (Cu+Zn+Al) Mixed Particles
2023
·
Jin Zhou
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Thermal Reliability Study of Si-based Chip Nanosilver Sintered Interconnects
2022
·
Peng Ma
, Guisheng Gan
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Microstructure and Property of Sn–37Pb Solder Bumps in Ø0.6 mm Ball during Thermal Shock
2019
·
Guisheng Gan
, Daquan Xia
, et al.
·
MATERIALS TRANSACTIONS
PDF
Microstructure Evolution of TiB2/7075 Composites in Semi-Solid State near Liquids within Holding Time
2019
·
Gui Sheng Gan
, Da Quan Xia
, et al.
·
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux
2018
·
Da-quan Xia
, Dong-hua Yang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
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Works count:
19
Citation count:
58
H-index:
5
I10-index:
3
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