Work

Thermal Reliability Study of Si-based Chip Nanosilver Sintered Interconnects

Year: 2022

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept56209.2022.9873293

Authors: Peng Ma, Guisheng Gan, Cong Liu, Tian Huang, Xinglong Wang, Xiangtao Xu, Daquan Xia

Institution: Chongqing University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, China Postdoctoral Science Foundation, Chongqing University of Technology, Chongqing Municipal Education Commission

OpenAlex ID: W4297808564

FWCI:

Cites: 12

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Related to: 10