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Markus Heyne

Observed names: Heyne, Markus, M. H. Heyne, M. Heyne, M.H. Heyne, Markus H Heyne, Markus H. Heyne, Markus Hartmut Heyne
ORCID: 0000-0002-3903-3817
Observed ORCID: 0000-0002-3903-3817
OpenAlex ID: A5083029937
Plasma-Enhanced Atomic Layer Deposition of Two-Dimensional WS2 from WF6, H2 Plasma, and H2S
2017 · Benjamin Groven, Markus Heyne, et al. · Chemistry of Materials · 84
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Low temperature deposition of 2D WS 2 layers from WF 6 and H 2 S precursors: impact of reducing agents
2015 · A. Delabie, M. Caymax, et al. · Chemical Communications · 83
Controlled Sulfurization Process for the Synthesis of Large Area MoS2 Films and MoS2/WS2 Heterostructures
2015 · Daniele Chiappe, Inge Asselberghs, et al. · Advanced Materials Interfaces · 72
Multilayer MoS 2 growth by metal and metal oxide sulfurization
2016 · M. H. Heyne, D. Chiappe, et al. · Journal of Materials Chemistry C · 64
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Reactive plasma cleaning and restoration of transition metal dichalcogenide monolayers
2021 · Daniil Marinov, Jean-François de Marneffe, et al. · npj 2D Materials and Applications · 62
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Highly efficient and stable MoS 2 FETs with reversible n-doping using a dehydrated poly(vinyl-alcohol) coating
2016 · César J. Lockhart de la Rosa, Amirhasan Nourbakhsh, et al. · Nanoscale · 59
WS2 transistors on 300 mm wafers with BEOL compatibility
2017 · T. Schram, Q. Smets, et al. · European Solid-State Device Research Conference · 43
Improved Plasma Resistance for Porous Low-k Dielectrics by Pore Stuffing Approach
2014 · Liping Zhang, Jean-Francois de Marneffe, et al. · ECS Journal of Solid State Science and Technology · 35
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Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics
2015 · J.-F. de Marneffe, L. Zhang, et al. · Journal of Applied Physics · 23
Two-dimensional WS 2 nanoribbon deposition by conversion of pre-patterned amorphous silicon
2016 · Markus H Heyne, Jean-François de Marneffe, et al. · Nanotechnology · 22
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Quantitative characterization of pore stuffing and unstuffing for postporosity plasma protection of low-k materials
2014 · Markus H. Heyne, Liping Zhang, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 18
The conversion mechanism of amorphous silicon to stoichiometric WS 2
2018 · Markus H. Heyne, Jean-François de Marneffe, et al. · Journal of Materials Chemistry C · 11
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A route towards the fabrication of 2D heterostructures using atomic layer etching combined with selective conversion
2019 · Markus H Heyne, Daniil Marinov, et al. · 2D Materials · 7
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Thermal recrystallization of short-range ordered WS2 films
2018 · Markus H. Heyne, Jean-François de Marneffe, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 7
BEOL compatible WS2 transistors fully fabricated in a 300 mm pilot line
2017 · T. Schram, Q. Smets, et al. · Silicon Nanoelectronics Workshop (SNW) · 7
Atomic layer processing of 2D materials for beyond CMOS applications
2016 · Annelies Delabie, Matty Caymax, et al.
Synthesis of wafer-scale TMD films and heterostructures by chemical vapor sulfurization and selenization
2016 · Daniele Chiappe, Inge Asselberghs, et al.
Atomic layer deposition of 2D transition metal dichalogenides
2015 · Annelies Delabie, Matty Caymax, et al.
Reducing agents for the atomic layer deposition of WS2 from the WF6 and H2S precursors
2015 · Annelies Delabie, Markus Heyne, et al.
Plasma enhanced atomic layer deposition of two-dimensional WS2 from WF6, H2S and H2 plasma precursors
2015 · Benjamin Groven, Markus Heyne, et al.
Monolayer controlled deposition of 2D transition metal dichalcogenides on large area substrates
2015 · Annelies Delabie, Benjamin Groven, et al.
Investigations on the plasma-surface interaction during atomic layer etching of thin transition-metal dichalcogenide films
2015 · Markus Heyne, Jean‐François de Marneffe, et al.
Effect of 147nm photons on porous Organo-Silicon Glass materials and damage improvement by optimized Cu/low-k integration approaches
2014 · Liping Zhang, Jean‐François de Marneffe, et al.
Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
2014 · Jean‐François de Marneffe, Liping Zhang, et al.
An experimental study of VUV plasma damage on porous organo-silicon glass materials
2013 · Jean‐François de Marneffe, Mikołaj Łukaszewicz, et al.
Works count: 29
Citation count: 597
H-index: 11
I10-index: 12
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