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D.J. Pedder

Observed names: D J Pedder, D J. Pedder, D. J. Pedder, D. Pedder, David J. Pedder, David J. Pedder
ORCID: 0000-0002-5194-4082
Observed ORCID: 0000-0002-5194-4082
OpenAlex ID: A5086801546
Don’t grin when you win: The social costs of positive emotion expression in performance situations.
2013 · Elise K. Kalokerinos, Katharine H. Greenaway, et al. · Emotion · 112
Thin-film infrared absorber structures for advanced thermal detectors
1988 · A. D. Parsons, D. J. Pedder · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 81
Microwave characterisation of microstrip lines and spiral inductors in MCM-D technology
2003 · R.G. Arnold, D.J. Pedder · IEEE Electronic Components and Technology Conference (ECTC) · 40
Microwave characterization of microstrip lines and spiral inductors in MCM-D technology
1992 · R.G. Arnold, D.J. Pedder · IEEE Transactions on Components Hybrids and Manufacturing Technology · 37
Reduced facial reactivity as a contributor to preserved emotion regulation in older adults.
2015 · David J. Pedder, Gill Terrett, et al. · Psychology and Aging · 28
Mental health, operational stress, and organizational stress among sworn and unsworn police personnel.
2022 · Tracey Varker, Meg J. Dennison, et al. · Traumatology An International Journal · 26
Silicon MCM-D technology for RF integration
2002 · R.G. Arnold, C.C. Faulkner, et al. · International Conference on Multichip Modules (ICMCM) · 25
Flip Chip Solder Bonding for Microelectronic Applications
1988 · D.J. Pedder · Hybrid Circuits · 25
Uncooled infrared thermal detector arrays
1990 · N. M. Shorrocks, Stephen G. Porter, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 21
Silver‐Ruthenium Dioxide Contacts
1976 · D. J. Pedder · Active and Passive Electronic Components · 20
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New Infra-Red Window Materials
1983 · J. A. Beswick, D. J. Pedder, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 17
Age Differences in Emotion Regulation and Facial Muscle Reactivity to Emotional Films
2019 · Izelle Labuschagne, David J. Pedder, et al. · Gerontology · 16
The thermal stability of cadmium oxide in internally oxidized silver-cadmium alloys
1978 · D. J. Pedder · Metallurgical Transactions A · 15
The impact of packaging on the reliability of flip-chip solder bonded devices
1990 · K.J. Lodge, D.J. Pedder · IEEE Transactions on Components Hybrids and Manufacturing Technology · 14
Flip chip-bonded GaAs MMICs compatible with foundry manufacture
1991 · D.J. Warner, K.L. Pickering, et al. · IEE Proceedings H Microwaves Antennas and Propagation · 12
Prototype packages in aluminum nitride for high performance electronic systems
1990 · K.J. Lodge, J.A. Sparrow, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 12
Technologies And Performance For Linear And Two Dimensional Pyroelectric Arrays
1985 · R. Watton, F. Ainger, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12
Hydrogen plasmas for flux free flip‐chip solder bonding
1990 · K. Pickering, P. Southworth, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 11
The preparation and performance of reticulated targets for the pyroelectric vidicon
1981 · D. J. Warner, D. J. Pedder, et al. · Ferroelectrics · 10
Interconnection technologies for multichip assemblies (ITMA)-A UK Information Technology Engineering Directorate hybrid wafer scale project
2002 · D.J. Pedder · International Conference on Wafer Scale Integration (ICWSI) · 8
Interconnection and packaging of solid-state circuits
1989 · D.J. Pedder · IEEE Journal of Solid-State Circuits · 8
The Characterisation of Novel PWB Substrate Materials for Leadless Ceramic Chip Carrier Attachment
1986 · C.J. Brierley, D.J. Pedder, et al. · Hybrid Circuits · 8
Identifying as in, out, or sexually inexperienced: Perception of sex-related personal disclosures
2015 · Leah M. Kaufmann, Ben Williams, et al. · Sensoria A Journal of Mind Brain and Culture · 6
Process characterization and yield assessment in hybrid wafer scale integration
2003 · R. Turner, M. Robinson, et al. · International Conference on Wafer Scale Integration (ICWSI) · 6
Silicon substrate test structures for hybrid wafer scale technology
2002 · M.J. Davies, A.G. Munns, et al. · International Conference on Wafer Scale Integration (ICWSI) · 6
Works count: 54
Citation count: 646
H-index: 14
I10-index: 19
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