Work

The impact of packaging on the reliability of flip-chip solder bonded devices

Year: 1990

Type: article

Source: IEEE Transactions on Components Hybrids and Manufacturing Technology

DOI: 10.1109/33.62529

Authors: K.J. Lodge, D.J. Pedder

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2175390504

FWCI: 2.34

Cites: 20

Cited by: 14

Related to: 10