Author

Jae Choon Kim

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Observed institutions: Korea University, Samsung (South Korea), Korea University, Samsung Electronics (South Korea)

ORCID: 0000-0003-0886-3903

Observed ORCID: 0000-0003-0886-3903

OpenAlex ID: A5091661237

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

2020 · Jae Choon Kim, Zongqing Ren, et al. · Journal of Electronic Packaging · 72

TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management

2018 · Zongqing Ren, Ziqi Yu, et al. · Nanotechnology · 24

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Transient Cooling and Heating Effects in Holey Silicon-Based Lateral Thermoelectric Devices for Hot Spot Thermal Management

2021 · Zongqing Ren, Jae Choon Kim, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 17

Development of temperature feedback control system for piezo-actuated display package

2009 · Jae Choon Kim, Jin Taek Chung, et al. · Sensors and Actuators A Physical · 8

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

2022 · Shiva Farzinazar, Zongqing Ren, et al. · Journal of Electronic Packaging · 7

Experimental Demonstration of Holey Silicon-Based Thermoelectric Cooling

2022 · Zongqing Ren, Jiahui Cao, et al. · IEEE Transactions on Electron Devices · 5

Investigation of the Cause of a Malfunction in a Display Package and Its Solution

2011 · Jae Choon Kim, Dong Jin Lee, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 1

Effect of Printed Circuit Board Structures on Temperature-Dependent Gain Characteristics of RF Power Amplifier Chips

2008 · Jeongkyu Heo, Jae Choon Kim, et al. · IEEE Microwave and Wireless Components Letters · 1

Numerical Simulation and Thermal Failure Analysis of SOM Package

2007 · Jae Choon Kim, Jin Taek Chung, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1

Hotspot Management by Holey Silicon-Metal Composites for 1 kW/cm2 and Beyond

2019 · Zongqing Ren, Ziqi Yu, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat Flow

2011 · Jichul Kim, Jae Choon Kim, et al. · IMAPSource Proceedings

Novel Disposable (or Single-Use) Bioreactor System Using Pneumatic Mixing Technology for Large/Small Scale Animal Cell Cultures

2009 · Duk Jae Oh, Jae Choon Kim, et al. · 한국생물공학회 학술대회

Numerical and Experimental Investigation on Thermal Characteristics of Deformable Thin Film Mirrors Package and Its Performance Optimization

2008 · Jae Choon Kim, Jin Taek Chung, et al. · ASME Heat Transfer Summer Conference (HT)

Performance Characteristics of a Polymer Electrolyte Fuel Cell with the Anodic Supply Mode

2006 · Yongtaek Lee, Yongchan Kim, et al. · ECS Meeting Abstracts

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Flow analysis and performance evaluation of the hydrogen recirculation system for fuel cells

2006 · Jae Choon Kim, Jin Taek Chung, et al.

Works count: 15

Citation count: 136

H-index: 5

I10-index: 3