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Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Year: 2020

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4047414

Authors: Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

Institutions: Samsung (South Korea), Samsung Electronics (South Korea), University of California, Irvine, IBM (United States), IBM Research - Austin, Toyota Motor North America Research & Development (United States), University of California San Diego

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3082298071

FWCI: 2.611

Cites: 156

Cited by: 72

Related to: 10