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Dan Kyung Suk Oh
Observed name:
Dan Oh
Observed institutions:
Intel (United States),
Altera (United States),
Samsung (South Korea),
Korea Research Institute of Standards and Science,
Rambus (United States),
Samsung Electronics (South Korea)
show all 6
ORCID:
0009-0000-5111-4372
Observed ORCID:
0009-0000-5111-4372
OpenAlex ID:
A5110148073
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
2020
·
Jae Choon Kim
, Zongqing Ren
, et al.
·
Journal of Electronic Packaging
·
73
Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications
2018
·
Kyoung-Lim Suk
, Seok Hyun Lee
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
72
Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
2018
·
Se-Ho You
, Seonghwan Jeon
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
65
Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems
2010
·
Joong-Ho Kim
, Dan Oh
, et al.
·
IEEE Transactions on Advanced Packaging
·
60
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
2018
·
Jisun Hong
, Kyoungsei Choi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
53
Multiple Edge Responses for Fast and Accurate System Simulations
2006
·
Dan Oh
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
29
Study of Advanced Fan-Out Packages for Mobile Applications
2018
·
Taejoo Hwang
, Dan Oh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
28
Performance Impact of Simultaneous Switching Output Noise on Graphic Memory Systems
2007
·
Joong-Ho Kim
, Woopoung Kim
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
27
Improving the target impedance method for PCB decoupling of core power
2014
·
Guang Chen
, Dan Oh
·
IEEE Electronic Components and Technology Conference (ECTC)
·
26
Precursor ISI Reduction in High-Speed I/O
2007
·
Jihong Ren
, Haechang Lee
, et al.
·
Symposium on VLSI Circuits
·
24
Design and characterization of a 12.8GB/s low power differential memory system for mobile applications
2009
·
Dan Oh
, Sam Chang
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
21
Jitter Amplification Considerations for PCB Clock Channel Design
2007
·
Chris Madden
, Sam Chang
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
21
A jitter equalization technique for minimizing supply noise induced jitter in high speed serial links
2014
·
Yujeong Shim
, Dan Oh
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
20
System level jitter characterization of high speed I/O systems
2012
·
Dan Oh
·
IEEE International Symposium on Electromagnetic Compatibility
·
20
Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems
2022
·
Taehwan Kim
, Jonggyu Lee
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
19
Advanced RDL Interposer PKG Technology for Heterogeneous Integration
2020
·
Jae-gwon Jang
, Kyoung-lim Suk
, et al.
·
International Wafer Level Packaging Conference (IWLPC)
·
19
Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for High-end Computing Applications
2020
·
Eunseok Song
, Dan Kyung Suk Oh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
19
System-level clock jitter modeling for DDR systems
2013
·
Yujeong Shim
, Dan Oh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
18
Differential-To-Common-Mode Conversion Suppression Using Mushroom Structure on Bent Differential Transmission Lines
2019
·
Seungjin Lee
, Jaehyuk Lim
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
17
Arria™ 10 device architecture
2015
·
Jeffrey Tyhach
, Mike Hutton
, et al.
·
Custom Integrated Circuits Conference
·
17
Improved PCB via pattern to reduce crosstalk at package BGA region for high speed serial interface
2014
·
Yujeong Shim
, Dan Oh
·
IEEE Electronic Components and Technology Conference (ECTC)
·
17
Jitter modeling in statistical link simulation
2008
·
Yu Chang
, Dan Oh
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
17
Hybrid Statistical Link Simulation Technique
2011
·
Dan Oh
, Jihong Ren
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
16
Prediction of System Performance Based on Component Jitter and Noise Budgets
2007
·
Dan Oh
, Frank Lambrecht
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
16
S-parameters Based Transmission Line Modeling with Accurate Low-Frequency Response
2006
·
Woopoung Kim
, Joong-ho Kim
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
16
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Works count:
91
Citation count:
1,031
H-index:
18
I10-index:
34
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