Work

Advanced RDL Interposer PKG Technology for Heterogeneous Integration

Year: 2020

Type: conference-paper

Source: International Wafer Level Packaging Conference (IWLPC)

DOI: 10.23919/iwlpc52010.2020.9375895

Authors: Jae-gwon Jang, Kyoung-lim Suk, Seok-hyun Lee, Jin-woo Park, Gwang-jae Jeon, Jung-ho Park, Jeong-gi Jin, Su-chang Lee, Gyoung-bum Kim, Joo-yeon Choi, Dae-woo Kim, Dan Oh, Won-kyoung Choi

Institution: Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3138964046

FWCI: 2.103

Cites: 7

Cited by: 19

Related to: 10