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Aldrin Vaquilar
Observed name:
VAQUILAR, ALDRIN
Institution:
IMEC
Observed institution:
IMEC
OpenAlex ID:
A5099516367
3D interconnects for quantum computing
2024
·
Jaber Derakhshandeh
, Anish Dangol
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift
2025
·
Tiffany Tang
, Alice Guerrero
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Challenges and Mitigations of Microbumps Pitch Scaling for Chiplet Applications
2025
·
Jaber Derakhshandeh
, Eric Beyne
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
1
Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift
2025
·
Tang, Tiffany
, Guerrero, Alice
, et al.
·
Zenodo (CERN European Organization for Nuclear Research)
Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift
2025
·
Tang, Tiffany
, Guerrero, Alice
, et al.
·
Zenodo (CERN European Organization for Nuclear Research)
Wafer Backside CoatingTM of electrically conductive die attach adhesives for small IC packaging
2009
·
Law Wai Ling
, Eric Erfe
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
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Works count:
6
Citation count:
13
H-index:
2
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