Work

Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift

Year: 2025

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51687.2025.00346

Authors: Tiffany Tang, Alice Guerrero, Dieter Cuypers, Maarten Macours, Aldrin Vaquilar, Pieter Bex, Koen Kennes, Alain Phommahaxay, Gerald Beyer, Eric Beyne

Institution: IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411688564

FWCI: 5.177

Cites: 5

Cited by: 3

Related to: 10