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David Sanchez

Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices
2018 · Manuel Fernandez, Xavier Perpina, et al. · IEEE Transactions on Industrial Electronics · 32
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Analysis of bidirectional switch solutions based on different power devices
2017 · M. Fernandez, X. Perpina, et al. · Spanish Conference on Electron Devices · 8
Analysis of Natural Convection Cooling Solutions for GaN HEMT Transistors
2018 · X. Jordà, X. Perpiñà, et al. · European Conference on Power Electronics and Applications · 6
Lock-in Infrared Thermography: A tool to locate and analyse failures in power devices
2017 · M. Vellvehi, X. Perpina, et al. · Spanish Conference on Electron Devices · 6
Determination of Anand viscoplastic constitutive parameters for the AuGe solder alloy from experimental stress-strain curves for power systems integration FEA simulations
2021 · Naum Fuste, Oriol Avino, et al. · Smart Systems Integration Conference and Exhibition (SSI) · 4
Analysis of SiC Schottky diodes after thermal vacuum test by means of lock-in infrared thermography
2020 · M. Vellvehi, X. Perpina, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Failure analysis in power devices using lock-in infrared thermography
2018 · M. Vellvehi, X. Perpina, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
Computation method and comparison of semiconductor power losses within bidirectional switches (BDS)
2017 · J.L. Galvez, X. Perpina, et al. · Spanish Conference on Electron Devices · 2
Poly(lactic acid- co -oxacyclohexadecenlactone) (PLH): A Bio-Based Substrate for Flexible Printed Electronic Devices
2026 · Aida Visús Martínez, Nathalie Marcela Cerón, et al. · ACS Applied Materials & Interfaces · 1
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Thermo-Mechanical Constraints for Packaging of Diamond Components
2022 · Naum Fuste, Emma Sola, et al. · IEEE International Workshop on Integrated Power Packaging (IWIPP) · 1
Study and simulation of anti-islanding algorithms for inverters working as a voltage source
2016 · D. Sanchez · RECERCAT (Consorci de Serveis Universitaris de Catalunya)
Works count: 12
Citation count: 65
H-index: 4
I10-index: 1
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