Work

Thermo-Mechanical Constraints for Packaging of Diamond Components

Year: 2022

Type: conference-paper

Source: IEEE International Workshop on Integrated Power Packaging (IWIPP)

DOI: 10.1109/iwipp50752.2022.9894116

Authors: Naum Fuste, Emma Sola, David Sanchez, Oriol Avino, Xavier Perpina, Miquel Vellvehi, Xavier Jorda

Institutions: Consejo Superior de Investigaciones Científicas, Institut de Microelectrònica de Barcelona

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4297984641

FWCI: 0.389

Cites: 31

Cited by: 1

Related to: 10