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Harrie A. C. Tilmans

Observed names: H A C Tilmans, H. A. C. Tilmans, H. A.C. Tilmans, H. Tilmans, H.A.C Tilmans, H.A.C. Tilmans, Harrie A C Tilmans, Harrie A. Tilmans, Harrie A.C. Tilmans, Harrie C. Tilmans, Harrie Tilmans, Tilmans, H., Tilmans, H. A. C., Tilmans, H.A.C., Tilmans, Harrie, Tilmans, Harrie A.C.
Observed institutions: University of Wisconsin–Madison, University of Washington, Institute of High Performance Computing, IMEC, Philips (Netherlands), University of Twente, KU Leuven
ORCID: 0000-0003-4240-4962
Observed ORCID: 0000-0003-4240-4962
OpenAlex ID: A5108371019
Electrostatically driven vacuum-encapsulated polysilicon resonators
1994 · Harrie A.C. Tilmans, Rob Legtenberg · Sensors and Actuators A Physical · 412
Pull-in voltage analysis of electrostatically actuated beam structures with fixed$ndash$fixed and fixed$ndash$free end conditions
2002 · Sayanu Pamidighantam, Robert Puers, et al. · Journal of Micromechanics and Microengineering · 373
Equivalent circuit representation of electromechanical transducers: I. Lumped-parameter systems
1996 · Harrie A C Tilmans · Journal of Micromechanics and Microengineering · 365
Micro resonant force gauges
1992 · Harrie A.C. Tilmans, Miko Elwenspoek, et al. · Sensors and Actuators A Physical · 281
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MEMS for wireless communications: from RF-MEMS components to RF-MEMS-SiP
2003 · Harrie A C Tilmans, Walter De Raedt, et al. · Journal of Micromechanics and Microengineering · 243
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Electrostatically driven vacuum-encapsulated polysilicon resonators Part I. Design and fabrication
1994 · Rob Legtenberg, Harrie A.C. Tilmans · Sensors and Actuators A Physical · 221
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Stiction of surface micromachined structures after rinsing and drying: model and investigation of adhesion mechanisms
1994 · Rob Legtenberg, Harrie A.C. Tilmans, et al. · Sensors and Actuators A Physical · 206
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Fine-grained polysilicon films with built-in tensile strain
1988 · H. Guckel, D.W. Burns, et al. · IEEE Transactions on Electron Devices · 158
Equivalent circuit representation of electromechanical transducers: II. Distributed-parameter systems
1997 · Harrie A C Tilmans · Journal of Micromechanics and Microengineering · 149
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Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes
2007 · X. Rottenberg, I. De Wolf, et al. · Journal of Microelectromechanical Systems · 147
Design considerations and technology assessment of phased-array antenna systems with RF MEMS for automotive radar applications
2005 · J. Schoebel, T. Buck, et al. · IEEE Transactions on Microwave Theory and Techniques · 108
Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices
2003 · A. Jourdain, P. De Moor, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 104
Mechanical properties of fine grained polysilicon-the repeatability issue
2003 · H. Guckel, D.W. Burns, et al. · Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head Workshop) · 94
Static and dynamic aspects of an air-gap capacitor
1992 · Dominicus J. Ijntema, Harrie A.C. Tilmans · Sensors and Actuators A Physical · 91
Resonating microbridge mass flow sensor
1990 · Siebe Bouwstra, Rob Legtenberg, et al. · Sensors and Actuators A Physical · 91
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Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices
2005 · A Jourdain, P De Moor, et al. · Journal of Micromechanics and Microengineering · 90
Through-silicon via and die stacking technologies for microsystems-integration
2008 · Eric Beyne, Piet De Moor, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 88
Applications of fluorocarbon polymers in micromechanics and micromachining
1994 · H.V. Jansen, J.G.E. Gardeniers, et al. · Sensors and Actuators A Physical · 84
Distributed dielectric charging and its impact on RF MEMS devices
2004 · Rottenberg, X., Nauwelaers, B., et al. · AMS Acta (University of Bologna) · 82
The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices
2000 · H.A.C. Tilmans, D.J. van de Peer, et al. · Journal of Microelectromechanical Systems · 82
Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
2002 · H.A.C. Tilmans, H. Ziad, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 73
A fully-packaged electromagnetic microrelay
1999 · H.A.C. Tilmans, E. Fullin, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 73
RF MEMS for ubiquitous wireless connectivity. Part I. Fabrication
2004 · H.J. De Los Santos, G. Fischer, et al. · IEEE Microwave Magazine · 71
Nonlinearity and hysteresis of resonant strain gauges
1998 · Chengqun Gui, R. Legtenberg, et al. · Journal of Microelectromechanical Systems · 69
Materials issues in the processing, the operation and the reliability of MEMS
2004 · A. Witvrouw, H.A.C. Tilmans, et al. · Microelectronic Engineering · 66
Works count: 253
Citation count: 5,519
H-index: 35
I10-index: 83
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