Author

Al Ruff

OpenAlex ID: A5108809658

Studies on Through-Chip Via Filling for Wafer-Level 3D Packaging

2006 · D. Barkey, John Callahan, et al. · ECS Meeting Abstracts · 2

Formation of AuSn Bumps for 3D Chip Stacking by Electrodeposition

2006 · B. Wu, Al Ruff, et al. · ECS Meeting Abstracts

Works count: 2

Citation count: 2

H-index: 1

I10-index: