Work

Formation of AuSn Bumps for 3D Chip Stacking by Electrodeposition

Year: 2006

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2006-02/35/1635

Authors: B. Wu, Al Ruff, John Callahan, George Hradil, Arthur Keigler, Zhen Liu, John Trezza

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W4255010965

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