Author

Thomas Geßner

Observed names: Gessner, T., Gessner, Thomas, Geßner, T., Geßner, Thomas, T Gessner, T. GESSNER, T. Gessner, T. Geßner, T. P. Gessner, THOMAS GESSNER, Thomas Gessner

Institution: Ansys (United States)

Observed institutions: Chongqing University, University of Freiburg, Tohoku University, Ansys (United States), University of Würzburg, Chemnitz University of Technology, Leibniz Institute for Solid State and Materials Research, Central Institute of Mental Health, BASF (Germany), Fraunhofer Institute for Electronic Nano Systems, Polytec (Germany), Hubei University of Automotive Technology, Fraunhofer Institute for Reliability and Microintegration, Sony (Japan), Center for Advancing Electronics Dresden, Advanced Institute for Materials Research, Tohoku University, Fraunhofer-Gesellschaft, Technische Universität Dresden, Ludwig-Maximilians-Universität München

OpenAlex ID: A5110057029

Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment

2013 · Jinji Luo, Detlef Billep, et al. · Journal of Materials Chemistry A · 371

Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing

2015 · Tobias Seifert, Enrico Sowade, et al. · Industrial & Engineering Chemistry Research · 277

Optimizing sonication parameters for dispersion of single-walled carbon nanotubes

2012 · Haibo Yu, Sascha Hermann, et al. · Chemical Physics · 139

Triarylmethane and Diarylmethane Dyes

2000 · Thomas Gessner, Udo Mayer · Ullmann's Encyclopedia of Industrial Chemistry · 113

Energy barriers at grain boundaries dominate charge carrier transport in an electron-conductive organic semiconductor

2018 · I. Vladimirov, M. Kühn, et al. · Scientific Reports · 108

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A novel technique for MEMS packaging: Reactive bonding with integrated material systems

2012 · J. Braeuer, J. Besser, et al. · Sensors and Actuators A Physical · 100

On‐Chip Micro‐Pseudocapacitors for Ultrahigh Energy and Power Delivery

2015 · Jiuhui Han, Yu‐Ching Lin, et al. · Advanced Science · 87

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Chemical post-treatment and thermoelectric properties of poly(3,4-ethylenedioxylthiophene):poly(styrenesulfonate) thin films

2014 · Jinji Luo, Detlef Billep, et al. · Journal of Applied Physics · 84

Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO[sub 2]

2009 · Thomas Waechtler, Steffen Oswald, et al. · Journal of The Electrochemical Society · 83

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High-Mobility, Ultrathin Organic Semiconducting Films Realized by Surface-Mediated Crystallization

2017 · I. Vladimirov, M. Kellermeier, et al. · Nano Letters · 82

Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology

2010 · Bianca Boettge, Joerg Braeuer, et al. · Journal of Micromechanics and Microengineering · 80

Optical properties and mechanical stress in SiO2/Nb2O5 multilayers

2001 · F Richter, H Kupfer, et al. · Thin Solid Films · 74

Thermal conductivity of ultra low-k dielectrics

2003 · A Delan, M Rennau, et al. · Microelectronic Engineering · 73

Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-k SiO2 xerogel films

2002 · C Murray, C Flannery, et al. · Microelectronic Engineering · 73

Core-Fluorinated Naphthalene Diimides: Synthesis, Characterization, and Application in n-Type Organic Field-Effect Transistors

2016 · Zhongyi Yuan, Yingjie Ma, et al. · Organic Letters · 64

Development of different copper seed layers with respect to the copper electroplating process

2000 · K Weiss, S Riedel, et al. · Microelectronic Engineering · 61

Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives

2010 · Lutz Hofmann, Ramona Ecke, et al. · Microelectronic Engineering · 59

Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects

2015 · Tobias Seifert, Mario Baum, et al. · Materials Today Proceedings · 55

ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems

2010 · Thomas Waechtler, Shao-Feng Ding, et al. · Microelectronic Engineering · 55

Toward Perylene Dyes by the Hundsdiecker Reaction

2014 · Yulian Zagranyarski, Long Chen, et al. · Organic Letters · 53

Silicon mirrors and micromirror arrays for spatial laser beam modulation

1998 · Steffen Kurth, Ramon Hahn, et al. · Sensors and Actuators A Physical · 52

A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers

2002 · Andreas Bertz, Matthias Küchler, et al. · Sensors and Actuators A Physical · 51

Understanding Polymorph Transformations in Core‐Chlorinated Naphthalene Diimides and their Impact on Thin‐Film Transistor Performance

2015 · Geoffrey E. Purdum, Nan Yao, et al. · Advanced Functional Materials · 48

Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators

2005 · Karla Hiller, Matthias Kuechler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 48

Surface chemistry of copper metal and copper oxide atomic layer deposition from copper( ii ) acetylacetonate: a combined first-principles and reactive molecular dynamics study

2015 · Xiao Hu, Jörg Schuster, et al. · Physical Chemistry Chemical Physics · 47

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Works count: 478

Citation count: 5,590

H-index: 35

I10-index: 151