Work

A novel technique for MEMS packaging: Reactive bonding with integrated material systems

Year: 2012

Type: article

Source: Sensors and Actuators A Physical

DOI: 10.1016/j.sna.2012.01.015

Authors: J. Braeuer, J. Besser, M. Wiemer, T. Gessner

Institutions: Fraunhofer Institute for Electronic Nano Systems, Chemnitz University of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Bundesministerium für Bildung und Forschung, Fraunhofer-Gesellschaft

Awards: G1847357180, G3712133456

OpenAlex ID: W2007248285

FWCI: 4.002

Cites: 24

Cited by: 100

Related to: 10