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K. Dieter Lang

Observed names: K-D Lang, K-D. Lang, K. -D. Lang, K. D. Lang, K.-D. Lang, K.-d. Lang, K.D. Lang, Lang, K.-D.
OpenAlex ID: A5110092991
Large area compression molding for Fan-out Panel Level Packing
2015 · T. Braun, S. Raatz, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 80
Sea water magnesium fuel cell power supply
2015 · Robert Hahn, Jan Mainert, et al. · Journal of Power Sources · 58
From wafer level to panel level mold embedding
2013 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 46
Through mold vias for stacking of mold embedded packages
2011 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 41
Development of a Multi-project Fan-Out Wafer Level Packaging Platform
2017 · T. Braun, S. Raatz, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 35
24"×18" Fan-out panel level packing
2014 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 25
Through mold via technology for multi-sensor stacking
2012 · T. Braun, M. Brundel, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 22
Challenges and opportunities for Fan-out Panel Level Packing (FOPLP)
2014 · T. Braun, K.-F. Becker, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 21
High frequency impedance of Li-ion batteries
2015 · T. Doersam, S. Schoerle, et al. · IEEE International Symposium on Electromagnetic Compatibility · 20
Power modules with embedded components
2014 · A. Ostmann, Lars Boettcher, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 18
Via last technology for direct stacking of processor and flash
2012 · Rene Puschmann, Mathias Bottcher, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16
Embedded power electronics for automotive applications
2012 · A. Ostmann, Th. Hofmann, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 14
Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
2011 · O. Holck, J. Bauer, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Foldable Fan-Out Wafer Level Packaging
2016 · T. Braun, K. -F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform
2014 · Wolfram Steller, Christoph Meinecke, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Design, Fabrication and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Side-by-Side Electrodes
2013 · K Hoeppner, M Ferch, et al. · Journal of Physics Conference Series · 11
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3D stacking approaches for mold embedded packages
2011 · T. Braun, K.-F. Becker, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 11
Embedding of wearable electronics into smart sensor insole
2016 · M. Hubl, O. Pohl, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 10
Small fuel cell system with cartridges for controlled hydrogen generation
2014 · Robert Hahn, Andreas Gabler, et al. · International Journal of Hydrogen Energy · 9
Improving the FE simulation of molded packages using warpage measurements
2014 · S. Huber, M.v. Dijk, et al. · Microelectronics Reliability · 9
Corrosion behaviour of sintered silver under maritime environmental conditions
2018 · E. Kolbinger, S. Wagner, et al. · Microelectronics Reliability · 8
Design, Fabrication, and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Interdigital Electrodes
2015 · K Hoeppner, M Ferch, et al. · Journal of Physics Conference Series · 7
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Automotive high voltage grid simulation modelling and simulation high voltage car grids from system prospective
2014 · S. Schoerle, E. Hoene, et al. · International Symposium on Electromagnetic Compatibility - EMC Europe (EMC Europe) · 7
Fan-out Wafer Level Packaging for MEMS and Sensor Applications
2014 · T. Braun, Karl‐Friedrich Becker, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 7
Manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes
2020 · D. Manessis, M. Seckel, et al. · Electronic System-Integration Technology Conference (ESTC) · 6
Works count: 65
Citation count: 610
H-index: 13
I10-index: 18
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