Work

Via last technology for direct stacking of processor and flash

Year: 2012

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2012.6249006

Authors: Rene Puschmann, Mathias Bottcher, Michael Ziesmann, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, M. Jurgen Wolf, K. Dieter Lang

Institutions: Fraunhofer Institute for Reliability and Microintegration, All Silicon System Integration Dresden, NXP (Germany)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1998798479

FWCI: 2.438

Cites: 5

Cited by: 16

Related to: 10