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Cheng-Ta Ko
Observed names:
C. T. Ko,
C.T. Ko
Observed institutions:
National Yang Ming Chiao Tung University,
Industrial Technology Research Institute
OpenAlex ID:
A5110113841
Wafer-level bonding/stacking technology for 3D integration
2009
·
Cheng-Ta Ko
, Kuan-Neng Chen
·
Microelectronics Reliability
·
212
Low temperature bonding technology for 3D integration
2011
·
Cheng-Ta Ko
, Kuan-Neng Chen
·
Microelectronics Reliability
·
181
Reliability of key technologies in 3D integration
2012
·
Cheng-Ta Ko
, Kuan-Neng Chen
·
Microelectronics Reliability
·
65
Wafer-to-wafer hybrid bonding technology for 3D IC
2010
·
Cheng-Ta Ko
, Zhi-Cheng Hsiao
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
23
Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding
2011
·
K. N. Chen
, C. A. Cheng
, et al.
·
Journal of Nanoscience and Nanotechnology
·
5
Dry Film Photo-Imageable Dielectric Enabling Glass Core Substrate TGV Filling and Build-Up
2025
·
Yaming Jiang
, Patrick Huang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
MOCVD growth of highly strained 1.3 μm InGaAs:Sb/GaAs vertical cavity surface emitting laser
2005
·
Y.A. Chang
, J.T. Chu
, et al.
·
Journal of Crystal Growth
·
3
Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology
2024
·
M. L. Shih
, P. S. Shih
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
1
Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration
2012
·
Kuan-Neng Chen
, Cheng-Ta Ko
, et al.
·
Journal of Nanoscience and Nanotechnology
·
1
Investigation of bonding temperature for SU-8 materials in wafer-level hybrid bonding technology for 3D IC
2011
·
C. A. Cheng
, C. T. Ko
, et al.
·
IEEE International Nanoelectronics Conference
·
1
Stretchable circuit with elastic bumps
2008
·
Ying-Ching Shih
, Cheng-Ta Ko
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding
2015
·
Y.J. Chang
, C.T. Ko
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
3D Integration with Wafer-to-Wafer Bonding
2012
·
W. C. Lo
, C. T. Ko
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
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Works count:
13
Citation count:
496
H-index:
5
I10-index:
4
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