Low temperature bonding technology for 3D integration
Year: 2011
Type: article
Source: Microelectronics Reliability
Authors: Cheng-Ta Ko, Kuan-Neng Chen
Institution: National Yang Ming Chiao Tung University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2018668032