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Jean-Damien Chapon

Observed names: J. D. Chapon, Jean Damien Chapon
Observed institution: STMicroelectronics (France)
OpenAlex ID: A5110141465
Design and use of multivariate approach error analysis APC system
2006 · Jean de Caunes, Joost van Herk, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9
Evaluation of wet-developable KrF organic BARC to improve CD uniformity for implant application
2004 · Isabelle D. Guilmeau, Alice F. Guerrero, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9
Improved CD control for 45-40 nm CMOS logic patterning: anticipation for 32-28 nm
2010 · Bertrand Le Gratiet, Frank Sundermann, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
ARC stack development for hyper-NA imaging
2007 · Vincent Farys, Scott Warrick, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
Process control for 45 nm CMOS logic gate patterning
2008 · Bertrand Le Gratiet, Pascal Gouraud, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Complementary double-exposure technique (CODE): a way to print 80-nm gate level using a double-exposure binary mask approach
2002 · Serdar Manakli, Yorick Trouiller, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Convergence towards large perimeter overlay Run-to-Run using multivariate APC system
2019 · Benjamin Duclaux, Alice Pelletier, et al. · ASMC proceedings · 3
Patterning critical dimension control for advanced logic nodes
2015 · Bertrand Le-Gratiet, Jean De-Caunes, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 3
Improving lithography intra wafer CD for C045 implant layers using STI thickness feed forward?
2008 · Jean Massin, Bastien Orlando, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Comparison between organic spin-on BARC and carbon-containing CVD stack for 65-nm gate patterning
2005 · Jean-Damien Chapon, Catherine Chaton, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Gate imaging for 0.09-μm logic technology: comparison of single exposure with assist bars and the CODE approach x
2003 · Yorick Trouiller, Jerome Belledent, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Approaches of multilayer overlay process control for 28nm FD-SOI derivative applications
2018 · Benjamin Duclaux, Jean De Caunes, et al. · Metrology, Inspection, and Process Control XXXVI · 2
Characterization of inverse SRAF for active layer trenches on 45-nm node
2007 · Jean-Christophe Urbani, Jean-Damien Chapon, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
65nm OPC and design optimization by using simple electrical transistor simulation
2005 · Yorick Trouiller, Thierry Devoivre, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Intrafield process control for 45 nm CMOS logic patterning
2009 · Bertrand Le Gratiet, Jean Massin, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Correction of long-range effects applied to the 65-nm node
2005 · Jerome Belledent, James Word, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Run to run and model variability of overlay high order process corrections for mean intrafield signatures
2020 · Benjamin Duclaux, Maxime Gatefait, et al. · Metrology, Inspection, and Process Control XXXVI
Immersion lithography robustness for the C065 node
2006 · Scott Warrick, Rob Morton, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
Works count: 18
Citation count: 61
H-index: 4
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