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Paul V. McLaughlin

Observed names: P. MCLAUGHLIN, JR., P. McLaughlin, P. V. McLAUGHLIN, P. V. McLaughlin, P.V. Jr. McLaughlin, P.V. McLaughlin
Observed institutions: IBM (United States), University of Ulster, University of Illinois Urbana-Champaign, Iowa State University, IBM Research - Albany, Villanova University, University of Delaware
OpenAlex ID: A5111381534
22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
2012 · S. Narasimha, P. Chang, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 95
High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL
2006 · W-H. Lee, A. Waite, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 53
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
2017 · T. Nogami, X. Zhang, et al. · Symposium on VLSI Technology · 32
Limit behavior of fibrous materials
1970 · P.V. McLaughlin, S.C. Batterman · International Journal of Solids and Structures · 30
Plastic limit behavior and failure of filament reinforced materials
1972 · P.V. McLaughlin · International Journal of Solids and Structures · 27
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
2017 · T. Nogami, R. Patlolla, et al. · IEEE International Interconnect Technology Conference (IITC) · 25
Infrared Thermographic Flaw Detection in Composite Laminates
1987 · P. V. McLaughlin, M. G. Mirchandani, et al. · Journal of Engineering Materials and Technology · 25
Non-destructive examination of fibre composite structures by thermal field techniques
1980 · P.V. McLaughlin, E.V. McAssey, et al. · NDT International · 24
Failure and fatigue mechanisms in composite materials
1975 · B. W. Rosen, S. V. Kulkarni, et al. · NASA Technical Reports Server (NASA) · 12
Failure Analysis of Cast Irons Under General Three-Dimensional Stress States
1976 · R. E. Frishmuth, P. V. McLaughlin · Journal of Engineering Materials and Technology · 10
Ru Liner Scaling with ALD TaN Barrier Process for Low Resistance 7 nm Cu Interconnects and Beyond
2018 · K. Motoyama, O. van der Straten, et al. · IEEE International Interconnect Technology Conference (IITC) · 9
Effects of phase geometry and volume fraction on the plane stress limit analysis of a unidirectional fiber-reinforced composite
1975 · Saurindranath Majumdar, P.V. McLaughlin · International Journal of Solids and Structures · 9
Fatigue damage in notched composite laminates
1977 · R.Byron Pipes, S.V. Kulkarni, et al. · Materials Science and Engineering · 8
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
2018 · P. S. Bhosale, J. Maniscalco, et al. · IEEE International Interconnect Technology Conference (IITC) · 7
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS Technology in a stacked die package with C4 and wirebond interconnections
2008 · Christopher Muzzy, David Danovitch, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Weaving multilayer fabrics for reinforcement of engineering components
1993 · B.J. Hill, R. McIlhagger, et al. · Composites Manufacturing · 7
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Upper Bounds to In-Plane Shear Strength of Unidirectional Fiber-Reinforced Composites
1973 · S. Majumdar, P. V. McLaughlin · Journal of Applied Mechanics · 7
Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections
2007 · Mukta Farooq, Ian Melville, et al. · IEEE International Interconnect Technology Conference (IITC) · 6
Elastic behavior, brittle failure and plastic flow of filamentary materials
1973 · P.V. McLaughlin, S. Majumdar, et al. · International Journal of Solids and Structures · 6
A 0.18 /spl mu/m high-performance logic technology
1999 · S. Crowder, S. Greco, et al. · Symposium on VLSI Technology · 5
Qualification of Low-k 65nm Technology Die with Pb-free Bumps on a 2-2-2 Laminate Package (PBGA) with Pb-free Assembly Processes
2007 · Sudipta Ray, Jennifer Muncy, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
NDT of Composites by Thermography
1981 · P. McLaughlin, Edward V. McAssey, et al. · Iowa State University Digital Repository (Iowa State University) · 4
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Properties of Work-Hardening Materials With a Limit Surface
1973 · P. V. McLaughlin · Journal of Applied Mechanics · 4
On Extending the Range of Applicability of the Limit Theorems
1970 · P. V. McLaughlin, S. C. Batterman · Journal of Applied Mechanics · 4
Fatigue of notched fiber composite laminates. Part 1: Analytical model
1975 · P. McLaughlin, S. V. Kulkarni, et al. · NASA STI Repository (National Aeronautics and Space Administration) · 3
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Works count: 33
Citation count: 436
H-index: 10
I10-index: 10
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