Get started
Author

Po-Jen Zheng

OpenAlex ID: A5111633722
On-chip high-Q inductor using wafer-level chip-scale package technology
2007 · Hsueh-An Yang, Chen-Chao Wang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 9
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
2003 · Po-Jen Zheng, J.Z. Lee, et al. · Microelectronics Reliability · 5
Works count: 2
Citation count: 14
H-index: 2
I10-index:
Year
Topic
Type