Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
Year: 2003
Type: article
Source: Microelectronics Reliability
Authors: Po-Jen Zheng, J.Z. Lee, K.H. Liu, J.D. Wu, S.C. Hung
Institution: Advanced Semiconductor Engineering (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2016391975