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Sridhar K. Kailasam

Observed names: S. K. Kailasam, S. Kailasam, S.K. Kailasam
OpenAlex ID: A5111658746
Evaluation of the methods for calculating the concentration-dependent diffusivity in binary systems
1999 · Sridhar K. Kailasam, Jeffrey C. Lacombe, et al. · Metallurgical and Materials Transactions A · 52
Stress migration and the mechanical properties of copper
2005 · G.B. Alers, J. Sukamto, et al. · IEEE International Reliability Physics Symposium proceedings · 25
Investigation of microstructural coarsening in Sn-Pb alloys
1999 · Sridhar K. Kailasam, ME. Glicksman, et al. · Metallurgical and Materials Transactions A · 22
Barrier-first integration for improved reliability in copper dual damascene interconnects
2004 · G.B. Alers, R.T. Rozbicki, et al. · IEEE International Interconnect Technology Conference (IITC) · 20
Ti-based Barrier for Cu Interconnect Applications
2008 · W. Wu, H.-J. Wu, et al. · IEEE International Interconnect Technology Conference (IITC) · 12
A simplified method for calculating the diffusivity matrix in ternary alloys
1999 · S.K. Kailasam, M.E. Glicksman · Acta Materialia · 11
Investigation of Aluminum-Indium Alloys for Interconnect Applications
2000 · Sridhar K. Kailasam, Shyam P. Murarka, et al. · Journal of The Electrochemical Society · 4
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Investigation of the Homovalent Impurity in Aluminum to Form Alloys With Enhanced Interconnect Reliability
1998 · Sridhar K. Kailasam, S. P. Murarka, et al. · MRS Proceedings · 2
An Approach for Real Time Testing Reliability& Usability Testing Process
2013 · A. Saravanan, M.Rajaguru, et al. · International Journal of Innovative Research in Computer and Communication Engineering · 1
Formation of Metal-derived Layers by Simultaneous Deposition and Evaporation of Metal (Granted)
2003 · Joseph Dalton, R. A. Powell, et al.
Investigation of homovalent alloying elements for interconnect alloys containing zero-flux planes
2000 · Sridhar K. Kailasam
Works count: 11
Citation count: 149
H-index: 6
I10-index: 6
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