Work

Stress migration and the mechanical properties of copper

Year: 2005

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/relphy.2005.1493058

Authors: G.B. Alers, J. Sukamto, P. Woytowitz, X. Lu, S. Kailasam, J. Reid

Institution: PayPal (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2113165751

FWCI: 8.605

Cites: 6

Cited by: 25

Related to: 10