Author

Li Ming Chu

Observed names: L M Chu, L. M. Chu, L.M. Chu
ORCID: 0009-0000-6875-9302
Observed ORCID: 0009-0000-6875-9302
OpenAlex ID: A5111664131
2016 · Li Ming Chu, Jaw-Ren Lin, et al. · Industrial Lubrication and Tribology · 4
2021 · Y P Chang, L M Chu, et al. · Journal of Physics Conference Series · 2
2019 · Yuh Ping Chang, Li Ming Chu, et al. · Key engineering materials · 2
2017 · Li Ming Chu, Jaw Ren Lin, et al. · Key engineering materials · 2
2011 · Hsiang Chen Hsu, Li Ming Chu · Advanced materials research · 2
2024 · L M Chu, M J Hsieh, et al. · Journal of Physics Conference Series · 1
2024 · M J Hsieh, L M Chu, et al. · Journal of Physics Conference Series · 1
2013 · Yuh Ping Chang, Huann Ming Chou, et al. · Applied Mechanics and Materials · 1
2011 · Chao Ming Lin, Tzu Chao Lin, et al. · Advanced materials research · 1
2009 · H.C. Hsu, L.M. Chu, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
2025 · M J Hsieh, J C Wang, et al. · Journal of Physics Conference Series
2024 · Yuh Ping Chang, Hsiang Yu Wang, et al. · Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum
2021 · Yuh Ping Chang, Li Ming Chu, et al. · Key engineering materials
2019 · Yuh Ping Chang, Li Ming Chu, et al. · Key engineering materials
2017 · Yuh Ping Chang, Richard Lin, et al. · Key engineering materials
2015 · Li Ming Chu, Hsiang Chen Hsu · Applied Mechanics and Materials
2014 · J. R. Lin, Li Ming Chu, et al. · FDMP: Fluid Dynamics & Materials Processing
2014 · H.C. Hsu, J.H. Chien, et al. · International Conference on Electronics Packaging (ICEP)
Works count: 26
Citation count: 20
H-index: 2
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