Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging
Year: 2011
Type: article
Abstract: This paper develops a computational model for predicting the failure probability of multilayered packages fabricated using anisotropic conductive film (ACF). The ACF and NCA are stacked layers by layers, and spaced with each other. The analyzed pads array 10x10 combined with specified geometry parameters in the IC/ Substrate are used to analyze the failure probability. The computational results indicate that the multilayered analysis developed in this study can provide lower failure probability by means of reducing bridging effects for improving the ACF packaging yield.
Source: Advanced materials research
Authors: Chao Ming Lin, Tzu Chao Lin, Li Ming Chu
Institutions: WuFeng University, I-Shou University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Funder: National Science Council
OpenAlex ID: W2032677800