Author

I.R. Abothu

Observed names: I ABOTHU, I. R. Abothu, Isaac R. Abothu, Isaac ROBIN ABOTHU, Isaac Robin ABOTHU, Isaac Robin Abothu
OpenAlex ID: A5111697347
1999 · Shi-Fang Liu, Isaac Robin Abothu, et al. · Materials Letters · 88
1999 · Sridhar Komarneni, Isaac Robin Abothu, et al. · Journal of Sol-Gel Science and Technology · 49
1999 · Isaac Robin Abothu, A.V. Prasada Rao, et al. · Materials Letters · 47
1999 · Isaac Robin Abothu, Shi-Fang Liu, et al. · Materials Research Bulletin · 40
2007 · P.M. Raj, D. Balaraman, et al. · IEEE Transactions on Components and Packaging Technologies · 26
2006 · B LEE, I ABOTHU, et al. · Scripta Materialia · 25
2005 · P.M. Raj, P. Muthana, et al. · International Symposium on Advanced Packaging Materials · 23
2004 · A.O. Aggarwal, P.M. Raj, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 20
2007 · P.M. Raj, D. Balaraman, et al. · IEEE Transactions on Components and Packaging Technologies · 17
2004 · D. Balaraman, P. M. Raj, et al. · Journal of Electroceramics · 17
2005 · Lixi Wan, P.M. Raj, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
2004 · I.R. Abothu, P.M. Raj, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
1999 · P. Poosanaas, K. Tonooka, et al. · Journal of Intelligent Material Systems and Structures · 12
2004 · D. Balaraman, Jinwoo Choi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
1999 · B. Saruhan, H. Schneider, et al. · Journal of the European Ceramic Society · 11
2007 · Jin-Hyun Hwang, P. Markondeya Raj, et al. · Microelectronic Engineering · 10
2011 · P. Markondeya Raj, Shu Xiang, et al. · Journal of Materials Science Materials in Electronics · 9
2000 · Bilge Saruhan, Isaac Robin Abothu, et al. · Journal of the American Ceramic Society · 9
1999 · Isaac Robin Abothu, Yukio Ito, et al. · Ferroelectrics · 9
2006 · V. Sundaram, Rao Tummala, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
2007 · Isaac Robin Abothu, P. Markondeya Raj, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
2005 · K.J. Lee, S. Bhattacharya, et al. · International Symposium on Advanced Packaging Materials · 7
2004 · V. Sundaram, R. Tummala, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
2002 · Wanqin Jin, Isaac Robin Abothu, et al. · Industrial & Engineering Chemistry Research · 7
2001 · Aydin DOGAN, Patcharin POOSANAAS, et al. · Journal of the Ceramic Society of Japan · 7
Works count: 48
Citation count: 534
H-index: 12
I10-index: 16
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