Work

Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration

Year: 2006

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2006.1645836

Authors: V. Sundaram, Rao Tummala, B. Wiedenman, Fuhan Liu, P.M. Raj, I.R. Abothu, S. Bhattacharya, M. Varadarajan, E. Bongio, W. Sherwood

Institutions: Georgia Institute of Technology, Indian Institute of Science Bangalore

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Science Foundation, Georgia Institute of Technology, Engineering Research Centers

OpenAlex ID: W2147484109

FWCI: 1.059

Cites: 8

Cited by: 8

Related to: 10