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Sandra G. Malhotra

Observed names: S. G. MALHOTRA, S. G. Malhotra, S. Malhotra, S.G Malhotra, S.G. Malhotra, Sandra Malhotra
OpenAlex ID: A5111944128
Picosecond ultrasonics study of the vibrational modes of a nanostructure
2002 · G. Andrew Antonelli, Humphrey J. Maris, et al. · Journal of Applied Physics · 99
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
2001 · C-K. Hu, L. Gignac, et al. · Applied Physics Letters · 98
A high performance liner for copper damascene interconnects
2001 · D. Edelstein, C. Uzoh, et al. · IEEE International Interconnect Technology Conference (IITC) · 98
Analysis of thin film stress measurement techniques
1997 · S.G Malhotra, Z.U Rek, et al. · Thin Solid Films · 67
Electromigration Cu mass flow in Cu interconnections
2005 · C.-K. Hu, D. Canaperi, et al. · Thin Solid Films · 36
Depth dependence of residual strains in polycrystalline Mo thin films using high-resolution x-ray diffraction
1996 · S. G. Malhotra, Z. U. Rek, et al. · Journal of Applied Physics · 33
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Strain gradients and normal stresses in textured Mo thin films
1997 · S. G. Malhotra, Z. U. Rek, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 30
A high performance 0.13 μm copper BEOL technology with low-k dielectric
2002 · R.D. Goldblatt, B. Agarwala, et al. · IEEE International Interconnect Technology Conference (IITC) · 29
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
2004 · D. Edelstein, H. Rathore, et al. · IEEE International Reliability Physics Symposium proceedings · 24
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
2004 · D. Edelstein, C. Davis, et al. · IEEE International Interconnect Technology Conference (IITC) · 17
Effect of metal liner on electromigration in Cu Damascene lines
2005 · C.-K. Hu, L. M. Gignac, et al. · Journal of Applied Physics · 15
Depth-sensitive strain analysis of a W–Ta–W trilayer
1997 · S.G Malhotra, Z.U Rek, et al. · Thin Solid Films · 6
Integration of ALD-TaN Liners on Nanoporous Dielectrics
2005 · Bum Ki Moon, Tadashi Iijima, et al. · MRS Proceedings · 4
Crystallographic Texture and Phase Metrology During Damascene Copper Processing
2002 · K.J. Kozaczek, P.W. DeHaven, et al. · MRS Proceedings · 4
A study of the vibrational modes of a nanostructure with picosecond ultrasonics
2002 · G.Andrew Antonelli, Humphrey J. Maris, et al. · Physica B Condensed Matter · 3
An electron microscopy study of the precipitation of rhenium in the B2 nickel aluminide
1993 · D.C. Van Aken, D.P. Mason, et al. · Journal of materials research/Pratt's guide to venture capital sources · 3
High-Productivity Combinatorial PVD and ALD Workflows for Semiconductor Logic & Memory Applications
2009 · Imran Hashim, Chi-I Lang, et al. · MRS Proceedings · 2
Microstructure evolution of electroplated Cu during room temperature transient
2002 · M.A. Gribelyuk, S.G. Malhotra, et al. · IEEE International Interconnect Technology Conference (IITC) · 1
Microstructural Analysis of Copper Interconnections Using Picosecond Ultrasonics
2000 · James M.E. Harper, Sandra G. Malhotra, et al. · MRS Proceedings · 1
Texture in Sputtered MO Films
1993 · O.P. Karpenko, M. Vill, et al. · MRS Proceedings · 1
White-Beam Transmission Characterization of Texture in Mo Thin Films and Mo/W Multilayers
1993 · Marc Vill, S. G. MALHOTRA, et al. · MRS Proceedings · 1
Depth-Sensitive Strain Analysis of a W/Ta/W Trilayer
1996 · S. G. Malhotra, Z. U. Rek, et al. · MRS Proceedings
Depth profiling of strain in thin films and multilayers.
1996 · S. G. Malhotra · Deep Blue (University of Michigan)
Depth Dependence of Residual Strains in Textured Mo Thin Films Using High-Resolution X-Ray Diffraction
1995 · S. G. Malhotra, Z. U. Rek, et al. · MRS Proceedings
Principal Residual Strains as A function of Depth for Sputter Deposited Mo Thin Films
1994 · S. G. Malhotra, Z. U. Rek, et al. · MRS Proceedings
Works count: 26
Citation count: 572
H-index: 11
I10-index: 11
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