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Jin-Young Hur

Observed names: Hur, Jin-Young, Jin-young Hur, Jinyoung Hur
OpenAlex ID: A5113530872
Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
2018 · Seok-Bon Koo, Chang-Myeon Lee, et al. · Metals and Materials International · 25
Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films
2013 · Ho-Nyun Lee, Yoonsung Han, et al. · MATERIALS TRANSACTIONS · 15
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Effects of Co content on the Cu diffusion barrier property of electroless NiCoP film
2013 · Hong-Kee Lee, Jun-Mi Jeon, et al. · Metals and Materials International · 5
An Investigation of Ultrasonic Electroplating for Lithium Metal Anode Fabrication
2025 · Changmyeon Lee, Beom Tak Na, et al. · Journal of Electrochemical Science and Technology · 4
Electroless copper electrolytes and its surface characteristics for semiconductor interconnects
2013 · Hong-Kee Lee, Jin-Young Hur · Metals and Materials International · 4
A Study of Optimization of Electrodeposited CuSnZn Alloys Electrolyte and Process
2010 · Jin-Young Hur, Ho-Nyun Lee, et al. · Journal of the Korean institute of surface engineering · 4
A Study on Properties of Electrodeposited Nickel-Cobalt Alloy Films from Sulfamate Solution
2017 · Seokbon Koo, Junmi Jeon, et al. · Journal of the Korean institute of surface engineering · 2
Nano Palladium Catalyst Formation Assisted by Ultrasound for Electroless Copper Plating
2017 · Hong-Kee Lee, Chang-Myeon Lee, et al. · Nanoscience and Nanotechnology Letters · 2
Indium Tin Oxide Films with Low Resistivity at Room Temperature Using DC Magnetron Sputtering with Grid Electrode
2014 · Ho-Nyun Lee, Jin-Young Hur, et al. · MATERIALS TRANSACTIONS · 2
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Enhanced Pd Distribution by Three-Step Activation Process for Electroless Cu Plating
2012 · Changmyeon Lee, Hong-Kee Lee, et al. · ECS Meeting Abstracts · 2
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A Study on How to Improve Magnesium Anodizing Process with High Biocompatibility
2015 · Sang-jun Kwon, Jin-young Hur, et al. · Journal of the Korean institute of surface engineering · 1
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Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier
2014 · Chang-Myeon Lee, Jun-Mi Jeon, et al. · Journal of the Korean institute of surface engineering · 1
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Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath
2014 · Seokbon Koo, Jinyoung Hur, et al. · Journal of the Korean institute of surface engineering · 1
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Effect of Additional Electrical Current on Adhesion Strength between Copper and Polyimide Films
2013 · Jang-Hun Lee, Yoonsung Han, et al. · Journal of the Korean institute of surface engineering · 1
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Ultrasound-Assisted Pd Activation Process For Electroless Silver Plating
2011 · Chang-Myeon Lee, Min-Hyung Lee, et al. · Zenodo (CERN European Organization for Nuclear Research) · 1
Effects of Multi-Complex Agent Addition on Characteristics of Electroless Ni-P Solution
2010 · Hong-Kee Lee, Ho-Nyun Lee, et al. · Journal of the Korean institute of surface engineering · 1
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Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
2019 · Seok-Bon Koo, Chang-Myeon Lee, et al. · Metals and Materials International
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4차 산업혁명에 따른 시장요구 변화와 한국 표면처리 산업의 발전방향에 대한 연구
2018 · Seung-Jae Lee, Jin-Young Hur, et al.
The Influence of the Fourth Industrial Revolution in Market Demands and the Directions for Developing Korean Surface Finishing Industries
2018 · Seung-Jae Lee, Jin-Young Hur, et al. · Journal of the Korean institute of surface engineering
미세피치 플립칩 패키지 구현을 위한 Epig 표면처리에서의 무전해 팔라듐 피막특성 및 확산에 관한 연구
2017 · Jin-Young Hur, Changmyeon Lee, et al.
설파민산 니켈-코발트 합금도금 박막 물성에 대한 실험 연구
2017 · Seokbon Koo, jun mi jeon, et al.
A Study on the Adhesion Improvement of Immersion Copper Coatings using Complexing Agent
2015 · Seokbon Koo, Jumi Jeon, et al. · Journal of the Korean institute of surface engineering
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착화제를 이용한 치환동 도금층의 밀착력 향상에 관한 연구
2015 · Seokbon Koo, jun mi jeon, et al.
Ultrasound Assisted Sn-Ag-Pd Activation Process for Electroless Copper Plating
2014 · Chang-Myeon Lee, Jin-Young Hur, et al. · Journal of the Korean institute of surface engineering
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A study of deoxidation process to Tantalum diffusion barrier for the direct electroless copper plating
2013 · Hong-Kee Lee, Jin-Young Hur, et al. · 한국표면공학회 학술발표회 초록집
Works count: 34
Citation count: 71
H-index: 4
I10-index: 2
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