Work

Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

Year: 2019

Type: erratum

Source: Metals and Materials International

DOI: 10.1007/s12540-019-00240-3

Authors: Seok-Bon Koo, Chang-Myeon Lee, Sang-Jun Kwon, Jun-Mi Jeon, Jin-young Hur, Hong-Kee Lee

Institutions: Korea Institute of Industrial Technology, Korea Institute of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

Funders: National Research Foundation, Ministry of Trade, Industry and Energy

OpenAlex ID: W2921567775

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