Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Charan K. Gurumurthy
Observed name:
Charan Gurumurthy
Institution:
Intel (United States)
Observed institutions:
Intel (United States),
University of California, Santa Barbara,
Cornell University
OpenAlex ID:
A5113571949
Inter-firms collaboration of joint venture in IC foundry business
2006
·
Kuo-Cheng Ku
, Charan K. Gurumurthy
, et al.
·
Technovation
·
25
A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface
1997
·
Charan K. Gurumurthy
, Jinbao Jiao
, et al.
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
·
18
Controlling Interfacial Interpenetration and Fracture Properties of Polyimide/Epoxy Interfaces
2006
·
Charan Gurumurthy
, Edward J. Kramer
, et al.
·
The Journal of Adhesion
·
16
Virtual inter-firm collaborative framework—An IC foundry merger/acquisition project
2007
·
Kuo-Cheng Ku
, Hsing-Pei Kao
, et al.
·
Technovation
·
11
Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen
1997
·
Jinbao Jiao
, Charan K. Gurumurthy
, et al.
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
·
6
A collaborative model for capacity expansion of the IC foundry industry
2006
·
Kuo-Cheng Ku
, Hsing-Pei Kao
, et al.
·
The International Journal of Advanced Manufacturing Technology
·
2
Hydro-Thermal Fatigue Resistance Measurements on Polymer Interfaces
1998
·
Charan K. Gurumurthy
, Edward J. Kramer
, et al.
·
APS
Show more works
View as search
Works count:
7
Citation count:
78
H-index:
5
I10-index:
4
Year
Topic
Type
